Chip Molding Machine
Features
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● CCD image detection, feeding anti-reverse detection;
● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;
● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;
● Customized on demand, permanently provide quality service.
Customization:
TJIN Semiconductor Molding Machine - Customized Service
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Product Attributes:
- Auto Transfer Molding
- Auto Packaging Equipment
- Auto Packaging Equipment
- Injection Unit: Single
- Max. Mold Height: 400 Mm
- Screw Diameter: 35 Mm
- Cooling System: Water
- Control System: PLC
Packing and Shipping:
Product Name: Semiconductor Molding Machine
Packaging and Shipping:
- Each unit is packaged in a sturdy cardboard box to ensure safe transportation.
- The packaging also includes foam inserts to protect the delicate components of the machine.
- For international shipping, the machine will be packed in a wooden crate for extra protection.
- The package will be labeled with the product name, model number, and any necessary handling instructions.
- For domestic shipping, the machine will be shipped via a trusted courier service with tracking information provided.
- International shipping will be arranged through a reputable freight forwarder to ensure timely and secure delivery.
Technical Parameters:
| Technical Parameters |
Value |
| Screw Diameter |
35 mm |
| Model |
SM-1000 |
| Clamping Force |
1000 KN |
| Platen Size |
600 x 600 mm |
| Cooling System |
Water |
| Max. Mold Height |
400 mm |
| Capacity |
100 tons |
| Type |
Vertical Injection Molding Machine |
| Injection Pressure |
200 MPa |
| Heating Power |
12 KW |
| Product Features |
Auto Transfer Molding, Auto Packaging Equipment, Auto Transfer Molding, Semiconductor Packaging |
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).
FAQ:
- Q: What is the brand name of this product?
- A: The brand name is TJIN.
- Q: What is the model number of this product?
- A: The model number is 001.
- Q: Where is this product manufactured?
- A: This product is manufactured in China.
- Q: Does this product have any certifications?
- A: Yes, it is certified with ISO9001.
- Q: What is the minimum order quantity for this product?
- A: The minimum order quantity is 1.
- Q: How is this product packaged?
- A: It is packaged in wooden packaging.
- Q: What is the estimated delivery time for this product?
- A: The estimated delivery time is 40 days.
- Q: What are the accepted payment terms for this product?
- A: The accepted payment terms are TT (telegraphic transfer).
Product Tags:
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