: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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High Productivity Semiconductor Packaging Equipment Chip Molding Device

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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High Productivity Semiconductor Packaging Equipment Chip Molding Device

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High Productivity Semiconductor Packaging Equipment Chip Molding Device

Chip Molding Device 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long...

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High Productivity Semiconductor Packaging Equipment

High Productivity Chip Molding Device

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